Видео с ютуба Chiplet Interposer

CHIPLETS: Разделяй и властвуй | Будущее процессоров

Advanced Packaging Techniques (Semi 101)

Мир передовой упаковки

Driving Down The Cost of Next-Generation CPUs

Are Chiplets and Interposers Commercially Viable?

Heterogeneous integration: A system approach to advanced chiplet design

Interposers, Chiplets and...ButterDonuts?

8 Packaging process technology Can Organic Interposer eat Si Interposer's lunch a Trip with Bing

AMD ZEN 6 — Next-gen Chiplets & Packaging

RapidChiplet: How to Explore the Design Space of Inter-Chiplet Interconnects

Not Just Chips: Signal Integrity Analysis at the Dawn of the Interposer Era

Упаковка Часть 4 - 2.5D и 3D

Interposer placement using H01V head

Why Hybrid Bonding is the Future of Packaging

Package on Package Interposer Installation

2.5D ICs or interposer technology

#TechUpdate: Lightmatter's 3D Photonic Interposer

How Chiplets will Revolutionize the Electronic Design World

AMD, ARM and Intel back a universal standard for chiplets | Engadget

Organic interposer by 3D X-ray layer by layer

A Brief History of Semiconductor Packaging

Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon

ICCD2020: (PAPER ID: 209)/ presenter: Jinwoo Kim

Design Integration - Amy Lujan: Cost and Yield Analysis of Chiplet Packaging

Intel Leads the Way with Advanced Packaging